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Memory Sockets
 
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Site Updated September 10th, 2010

 * * * Sensata > Products > Burn-in Sockets > BGA >

BGA (Ball Grid Array) Memory Sockets
Extensive Line of Memory Socket Offerings


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Open top, auto–actuated socket
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Small socket outline — Maximizes burn-in board density and process throughput
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Multiple package outlines and heights — See table at bottom
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Custom options — Adapterless, coverless plus different lead lengths, plating, and color options available
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Proven contact
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Removable adapter


Design features of the BGA memory socket by Sensata

Mechanical Characteristics
Contact system
Varies based on Pb or Pb–free solder balls (10–20gms per pin)
Package insertion force
ZIF
Temperature range
-55°C to 150°C
Actuation force
Typical: 1–3.5kg

Electrical Characteristics
Current rating
0.25–0.50 amp per pin @ 125°C
Insulation resistance
1000 mohms at 500VDC
Dielectric voltage
Withstands 500VDC for 1 minute
Contact resistance at 10mA
Initial: 150 mOhm maximum
After 10K cycles: 1 Ohm maximum
Inductance
6nH at 50 MHz, approximately
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Socket attributes of the BGA memory socket by Sensata


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BGA Memory Socket Platforms (Series)
Pitch
Minimum Outline
Maximum Outline
Platform
1.27mm
19.5x24x17
33.2x28.4
CBGxxx-049
 
CBGxxx-059
 
 
1.00mm
27.5x32.5x17
46.2x46.2x18.4
CBGxxx-052
CBGxxx-069
CBGxxx-087
 
CBGxxx-A109
CLGxxx-012
 
FBGAxxx-027
FBGAxxx-030
0.80 mm
22x18x15.9
35x35x23
CBGxxx-051
CBGxxx-056
CBGxxx-057
CBGxxx-063
CBGxxx-073
CBGxxx-077
CBGxxx-095
CBGxxx-103
CBGxxx-A70
 
CBGxxx-A98
CBGxxx-A99
CBGxxx-A100
FBGAxxx-003
FBGAxxx-012
FBGAxxx-014
FBGAxxx-022
FBGAxxx-023
 
FBGAxxx-025
FBGAxxx-037
FBGAxxx-040
FBGAxxx-044
FBGAxxx-A104
FBGAxxx-A105
FBGAxxx-A110
FBGAxxx-A118
0.75mm
19x18x15.4
30x26.5x17.3
CBGxxx-020
CBGxxx-035
CBGxxx-042
 
CLGxxx-050
CBGxxx-A111
 
FBGAxxx-021
FBGAxxx-041
0.65mm
19x19x15.8
28x26x19
CBGxxx-079
 
CBGxxx-101
 
 
0.50mm
26x19.5x18.1
40x40x19.6
CBGxxx-086
CBGxxx-A85
 
CBGxxx-A87
CBGxxx-A94
 
CBGxxx-A120
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